{"version":"1.0","type":"card","id":"9f83c5fb-b03e-42bf-a19e-203fc9568935","url":"https://stacklist.com/card/9f83c5fb-b03e-42bf-a19e-203fc9568935","title":"HEXASpec","source_url":"https://www.hexaspec.com/","note":"HEXAspec develops high-thermal-conductivity semiconductor molding compounds that remove heat constraints in advanced chip packaging.\n","image":{"url":"https://ucarecdn.com/4b1cca67-38c1-43a1-996c-f09edb471704/","alt":"HEXASpec","width":1200,"height":630},"stack":{"id":"5cfa1a9c-1a02-45dc-90a9-31fe779d959d","title":"Innovation Cup Finalists","url":"https://stacklist.com/stack/5cfa1a9c-1a02-45dc-90a9-31fe779d959d"},"created_at":"2026-04-01T00:13:17.166Z","updated_at":null,"aco":null,"_links":{"self":"/api/public/card/9f83c5fb-b03e-42bf-a19e-203fc9568935.json","html":"https://stacklist.com/card/9f83c5fb-b03e-42bf-a19e-203fc9568935","md":"/api/public/card/9f83c5fb-b03e-42bf-a19e-203fc9568935.md","stack_json":"/api/public/stack/5cfa1a9c-1a02-45dc-90a9-31fe779d959d.json"}}